Absolics Secures CHIPS Act Funding to Advance Glass Substrate Technology in U.S. Semiconductor Manufacturing

Absolics has received CHIPS Act funding to develop glass substrate technology, enhancing U.S. semiconductor manufacturing capabilities.

May 23, 2024

In a significant move to bolster the United States' semiconductor manufacturing capabilities, Absolics, a subsidiary of South Korea's SK Group, has secured funding under the CHIPS and Science Act. This investment aims to advance the development of glass substrate technology, a critical component in the evolution of semiconductor packaging.

The CHIPS and Science Act, enacted to strengthen domestic semiconductor production and innovation, has been instrumental in supporting companies that contribute to the resilience and advancement of the U.S. semiconductor supply chain. Absolics' initiative aligns with the Act's objectives by focusing on glass substrates, which are poised to revolutionize semiconductor packaging.

The Role of Glass Substrates in Semiconductor Packaging

Glass substrates serve as foundational layers in semiconductor packaging, offering superior electrical insulation and mechanical stability compared to traditional materials. Their integration into semiconductor design is expected to enhance performance, reduce power consumption, and enable more compact device architectures. As industries increasingly demand high-performance computing solutions, the adoption of glass substrates becomes pivotal.

Absolics' Strategic Investment in Covington, Georgia

Absolics has announced plans to construct a state-of-the-art manufacturing facility in Covington, Georgia. This facility will specialize in the production of advanced glass substrates, positioning the United States at the forefront of semiconductor innovation. The establishment of this plant is anticipated to create approximately 1,200 jobs, contributing to local economic growth and reinforcing the domestic semiconductor ecosystem.

Implications for U.S. Semiconductor Independence

The development of a domestic glass substrate manufacturing capability addresses a critical gap in the U.S. semiconductor supply chain. Historically, the advanced packaging substrates market has been concentrated in Asia, leading to vulnerabilities in supply continuity. Absolics' initiative mitigates these risks by providing a reliable, U.S.-based source for this essential component, thereby enhancing national security and technological self-reliance.

Broader Impact on Advanced Technologies

The advancement of glass substrate technology has far-reaching implications beyond traditional computing. Applications in artificial intelligence, high-performance computing, and data centers stand to benefit from the improved performance metrics enabled by glass substrates. This development aligns with the broader trend of integrating advanced materials to meet the escalating demands of modern technologies.

Conclusion

Absolics' receipt of CHIPS Act funding marks a pivotal moment in the U.S. semiconductor industry's evolution. By investing in glass substrate technology, the United States takes a significant step toward securing its position as a leader in semiconductor innovation, ensuring the resilience of its supply chain, and meeting the technological demands of the future.

Share on:

Copy Link

Related blogs

Related blogs

Copyright 2025 USA NEWS all rights reserved

Copyright 2025 USA NEWS all rights reserved

Copyright 2025 USA NEWS all rights reserved

Copyright 2025 USA NEWS all rights reserved